There are many types of eNVM available in the market, differentiated by their endurance. For example, eFlash, eE2 PROM and eMTP can be programmed multiple times, whereas eOTP and eFuse can only be programmed once. eE2 PROM has excellent endurance among these five solutions, but the trade-off is larger macro size within high density memory. To leverage density and cost, eFlash and eE2 PROM are recommended for those high density NVM applications such smart card, SIM card, MCU, etc. On the other hand, eMTP and eOTP can be recommended for medium density NVM applications such PMIC and display driver IC. For lower density eNVM requirements in general purpose applications, eFuse is suggested.
Source: Secondary Information, LP Information Research Team; 2021
According to the new market research report “Global Embedded Non-Volatile Memory (ENVM) Market Report 2023-2029”, published by QYResearch, the global Embedded Non-Volatile Memory (ENVM) market size is projected to reach USD 27.87 billion by 2029, at a CAGR of 16.4% during the forecast period.
Figure. Global Embedded Non-Volatile Memory (ENVM) Market Size (US$ Million), 2018-2029
Figure. Global Embedded Non-Volatile Memory (ENVM) Top 9 Players Ranking and Market Share（Based on data of 2021, Continually updated）
The global key manufacturers of Embedded Non-Volatile Memory (ENVM) include TSMC, GlobalFoundries, UMC (Incl. Fujitsu), SMIC, Samsung, etc. In 2020, the global top four players had a share approximately 78.0% in terms of revenue.
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